Able to access to the leading foundry process technologies to 7/14/16nm through our partnerships with the world’s top foundries.
Designed more than 50 chips, with optimized PPA appropriate for customer’s specific targets.
Creative approaches to provide much more on/intra chip bandwidth in 32, 14 and 7nm technologies.
Completed multiple chips with HBM PHY, 30G/56G Serdes IP and 2.5D integration solutions.
Silicon proven SoC experience through 90nm to 7nm based on mainstream ARM/PowerPC CPU.
Provides complete design services ranging from initial architecture, testbench development, feature addition and IP customization.
Provides the fab device and integration experience for first-time tapeout success.
Tapeout support includes LVS, DRC, MEBES (manufacturing electronic beam exposure system) review and support, resulting in successful tapeouts.
FinFET ASIC Experts
2.5D/HBM2 Packing Solutions
SoC Turnkey Service
Product & Foundry Engineering