Able to access to the leading foundry process technologies to 7/14/16nm through our partnerships with the world’s top foundries. 

Designed more than 50 chips, with optimized PPA appropriate for customer’s specific targets.

Creative approaches to provide much more on/intra chip bandwidth in 32, 14 and 7nm technologies. 

Completed multiple chips with HBM PHY, 30G/56G Serdes IP and 2.5D integration solutions.

Silicon proven SoC experience through 90nm to 7nm based on mainstream ARM/PowerPC CPU. 

Provides complete design services ranging from initial architecture, testbench development, feature addition and IP customization.

Provides the fab device and integration experience for first-time tapeout success.

Tapeout support includes LVS, DRC, MEBES (manufacturing electronic beam exposure system) review and support, resulting in successful tapeouts.